This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a. EIA/JEDEC standards and publications contain material that has been prepared, Within the JEDEC organization there are procedures whereby an EIA/JEDEC. additional reliability stress testing (i.e., JESD22 A and JESD47 or the semiconductor manufacturer’s in-house procedures). Passing the reject criteria in this.

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This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes.

For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. The detailed use and application of burn-in is outside ejsd scope of this document. Filter by document type: It does not give pass or fail values or recommend specific test equipment, test structures or test algorithms. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones.

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. Projections ela be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers’ requirements.

Solid State Memories JC Pictures have been added to enhance the fail mode diagrams. This standard is intended to describe specific stresses and failure mechanisms that are specific to compound semiconductors and power amplifier modules. Registration or login required. Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration.

The purpose of this standard is to define a procedure for performing measurement and calculation of early life failure rates. This standard will be useful to anyone engaged in handling semiconductor devices and integrated circuits that are subject to permanent damage due to electrostatic potentials.

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The standard establishes a symbol and label that will gain the attention of those persons who might inflict electrostatic damage to jess device. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. Please see Annex C for revision history.

This standard applies to single- dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.

It does not jrsd the quality and reliability requirements that the component must satisfy. Terms, Definitions, and Symbols filter JC These tests are used frequently in qualifying integrated circuits as eja newproduct, a product family, or as products in a process which is being changed. Endurance and retention qualification specifications for cycle counts, durations, temperatures, and sample sizes are specified in JESD47 or may be developed using knowledge-based methods as in JESD It is intended to establish more meaningful and efficient qualification testing.

Show 5 10 20 results per page. These SMDs should be subjected to the jjesd preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing qualification and reliability monitoring to evaluate long term reliability which might be impacted by solder reflow.

Assembly level testing may not be a prerequisite for device qualification; however, if the effect of assembly conditions on the component is not known, there could be reliability concerns for that component that are not evident in component level testing.

Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser. This Standard specifies the procedural requirements for performing valid endurance and retention tests based on a qualification specification.

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During the test, accelerated stress temperatures are used without electrical conditions applied. A form of high jesv bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures.


The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.

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This publication contains a set eiia frequently recommended and accepted JEDEC reliability stress tests. Formerly known as EIA Search by Keyword or Document Number. Most of the content on this site remains free to download with registration. This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling.

This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time.

This document describes backend-level test and data methods for the qualification of semiconductor technologies. This test may be destructive, depending on time, temperature and packaging if any. In June the formulating committee approved the addition of the ESDA logo on the covers of this document.

As such, it is recommended that assembly level testing be performed to determine if there are any adverse effects on that component due to its assembly to a PWB. It establishes a set of data elements that describes the component and defines what each element means. The symbol contained in this label, jesx may be used on the device itself, shows a hand in a triangle with a bar through it.

Displaying 1 – 20 of 38 documents. This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD level requirements. It will be shown through this document why realistic modifying of the ESD target levels for component level ESD is not only essential but is also urgent.